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General Product Tech Notes

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General Micron Tech Notes

Technical Notes

File Title and Description sort ID Number sort Last Update sort Software Downloads
pdf SEMI wafer map format TN-00-21 Jul 2008
pdf Bypass Capacitor Selection for High-Speed Designs TN-00-06 Sep 1999
pdf Thermal Applications - Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature. TN-00-08 May 2008
pdf Understanding the Quality and Reliability Requirements for Bare Die Applications TN-00-14 Sep 2001
pdf Uprating of Semiconductors for High-Temperature Applications - Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer’s environmental specifications TN-00-18 May 2008
pdf Moisture Absorption in Plastic Packages - Describes the shipping procedures that ensure Micron’s customers receive memory devices that do not exhibit the popcorn effect TN-00-01 Mar 2007
pdf Micron Wire-Bonding Techniques TN-29-24 Jun 2007
pdf IBIS Behavioral Models TN-00-07 Sep 1999
pdf Accelerate Design Cycles with SIM Models TN-00-09 Oct 2006
pdf Recommended Soldering Parameters TN-00-15 Mar 2007
pdf Thinning Considerations for Wafer Products - Information on optimal wafer-thinning processes to meet specific customer requirements TN-00-19 Nov 2004