e-MMC™

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Targeting Your Mobile Multimedia Applications

Embedded applications require superior mass storage solutions. Our e-MMC™ embedded memory combines our high-quality, low-cost NAND Flash memory with a high-speed MultiMediaCard (MMC) controller in a single package.

e-MMC Embedded Memory Part Catalog and Documentation

Contact Micron for e-MMC™ Embedded Memory Parts and Documentation



Simplify High-Capacity Storage for Mobile and Embedded Systems

To meet the demand for higher densities, designers find themselves pressing wireless processors to support multiple-level cell (MLC) NAND Flash. Micron’s e-MMC embedded memory can help address the challenges—including increasing error correction code (ECC) requirements—sometimes associated with MLC NAND Flash devices.

Download our white paper to learn how e-MMC embedded memory simplifies high-capacity storage issues, and how it capitalizes on MLC strengths and, at the same time, improves overall system-level performance.

Download White Paper

High Quality, Low Cost with an MMC Controller

Streamlined Development and Qualification

Micron’s e-MMC embedded memory combines our high-quality, low-cost NAND Flash memory with a high-speed MultiMediaCard (MMC) controller in a low-profile BGA package. e-MMC embedded memory essentially transforms a program/erase/read device with bad blocks and bad bits (NAND) into a simple write/read memory. This managed interface addresses potential NAND design concerns internally, using error correction code (ECC), wear leveling, and bad block management technology. Handling errors internally takes the burden off the host controller and increases speed, providing higher system performance.

e-MMC embedded memory also simplifies hardware and software integration by providing a standard interface specification that minimizes the need for host software to accommodate process node migrations and different vendors’ NAND Flash devices. It’s a consistent, technology-independent solution that streamlines the development and qualification process and alleviates complexities of designing in current and future NAND devices.

e-MMC Features

  • 3.3V Vcc (3.3V or 1.8V I/O) or 1.8V Vcc (1.8V I/O)*
  • –25°C to +85°C operating temperature
  • 1-bit, 4-bit, or 8-bit I/Os

Technology Benefits

  • JEDEC standard
  • Supported by major mobile customers and enablers
  • Seamless transition from SLC NAND to MLC NAND
  • High speed: up to 52 MB/s
  • Compliant with the MMC specification

Product Benefits

  • Compatibility between host and storage devices
  • Ease of design and validation
  • Speeds time to market
  • Scalable for future use
  • Space-saving MCPs

Applications

  • Cellular phones
  • PDAs
  • Handheld electronics
  • Digital video cameras
  • Gaming
  • Industrial applications

*Contact factory for availability

4 Ways e-MMC Solutions Make Life Easier

Easy-to-Use BGA Package

Saves significant resources that would otherwise go to hardware and software development.

Managed Interface

Eases the design and validation process.

Handles Errors Internally

Increases speed and provides higher system performance.

High-Performance Controller

Removes the burden of several low-level tasks from the processor.

Why Buy Micron?

  • Technology Leader
    Micron's manufacturing efficiencies, cutting-edge innovations, and leading patent portfolio lead the industry in technological excellence.
  • Product Breadth
    With a full line of DRAM components, modules, and NAND Flash products, we have the right device for your design.
  • Technical Support
    Micron's engineering and technical assistance can provide the competitive advantage you need to get your designs to market faster.
  • Quality Products 
    Stringent quality and reliability testing makes our devices stand out as some of the highest-quality parts in the industry.
  • Customer Commitment
    We work closely with other vendors, manufacturers, and enablers to help you deliver a complete, proven solution.
  • Environmental Certification
    All devices are available in Pb-free versions, and many offer the added environmental protection of "green" packaging.