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These materials may contain projections or other forward-looking statements regarding future events or the future financial performance of the Company and its industry. We wish to caution you that such statements are predictions and that actual events or results may differ materially. We refer you to the documents the Company files on a consolidated basis from time to time with the Securities and Exchange Commission, specifically the Company’s most recent Form 10-K and Form 10-Q. These documents contain and identify important factors that could cause the actual results for the Company on a consolidated basis to differ materially from those contained in our projections or forward-looking statements (see Risk Factors). Although we believe that the expectations reflected in the forward-looking statements are reasonable, we cannot guarantee future results, levels of activity, performance, or achievements. We are under no duty to update any of the forward-looking statements after the date of the individual presentation to conform these statements to actual results.

What products does Micron manufacture?
What are Micron’s target markets?
What are your earnings projections for the next fiscal quarter and for the year?
What were your earnings last fiscal quarter?
What were your earnings for the last fiscal year?
When will you report your next fiscal quarter earnings?
How much cash does Micron currently have?
What are current and future capital spending levels?
What was depreciation and amortization last year? What do you project for the current year?
In what way does Micron differentiate itself from other semiconductor manufacturers?
How many manufacturing facilities do you have and where are they located?

What products does Micron manufacture?

Micron is an industry leading, global manufacturer and marketer of semiconductor devices, principally DRAM and NAND Flash memory, and CMOS image sensors. The Company’s products are offered in a wide variety of package and configuration options, architectures, and performance characteristics tailored to meet application and customer needs. Individual devices take advantage of the Company’s advanced silicon processing technology and manufacturing expertise. The Company continually introduces new generations of products that offer lower costs per unit and improved performance characteristics.

DRAM: Dynamic Random Access Memory (“DRAM”) products are high-density, low-cost-per-bit, random access memory devices that provide high-speed data storage and retrieval. In recent years, the Company has significantly increased its production and sales of specialty memory products such as pseudo-static RAM (“PSRAM”), Mobile SDRAM and Reduced Latency DRAM (“RLDRAM”). Specialty memory products are generally targeted to consumer electronics, networking, server and mobile applications that require specific performance characteristics such as high density, low power and low latency. The transition to specialty memory products has reduced the Company’s reliance on standardized, high-volume products sold for use as main memory in computers such as DDR2.

NAND Flash Memory: Flash memory products are electrically re-writeable, non-volatile semiconductor devices that retain memory content when power is turned off. The Company’s Flash efforts are concentrated on NAND Flash (“NAND”) devices which use semiconductor technology similar to DRAM. The market for NAND products has grown rapidly and the Company expects it to continue to grow due to demand for removable and embedded storage devices. Removable storage devices such as USB and Flash memory cards are used with applications such as personal computers, digital still cameras, MP3 players and mobile phones. Embedded NAND-based storage devices are also utilized in mobile phones and other personal and consumer applications. In 2007, the Company introduced 16 Gb NAND products and Multi-Level Cell (“MLC”) designs in addition to initiating production on 50nm process technology. The Company expects sales of NAND to increase significantly in fiscal 2008 as it further ramps production of the Lehi 300mm facility, increases production on 50nm process technology and begins the build-out of a new 300mm facility in Singapore. The increase in NAND production will also allow further internal sourcing options for Lexar, Micron’s subsidiary and a leading marketer and manufacturer of NAND flash memory products.

Imaging: Complementary Metal-Oxide Semiconductor (“CMOS”) image sensors are semiconductor devices that capture and process images into pictures or video for a variety of consumer and industrial applications. Our imagers combine the overwhelming advantages of CMOS with our exclusive DigitalClarity® technology for best-in-class image quality. Micron’s image sensors are available as stand-alone devices or complete camera systems-on-a-chip, in VGA or multi-megapixel resolutions, with varying pixel sizes, frame rates, and on-chip features. Low cost, low power consumption, and ease of design make them ideal imaging solutions for a wide array of products, ranging from cell phones and DSCs, to high-speed

To learn more about Micron’s broad portfolio of cutting-edge memory and imaging products visit the Company’s web site at:
www.micron.com/products/

What are Micron’s target markets?

Micron’s broad semiconductor product portfolio targets applications in nine markets including Computing, Mobile, Server, Networking and Communications, Consumer Electronics, Commercial and Industrial, Medical, Security, and Automotive.

What are your earnings projections for the next fiscal quarter and for the year?

Because of the volatility in the semiconductor industry, Micron Technology, Inc. does not make earnings projections.

As of April 14, 2008, independent industry analysts who follow the company projected Earnings Per Share (EPS) ranging from - $.45 to -$.09 for the third quarter of fiscal 2008, with average projected EPS of -$.33. The same independent industry analysts projected EPS ranges of -$1.60 to -$1.03 for fiscal year 2008, with average projected EPS of -$1.28 for the year.

Please note that any opinions, estimates, or forecasts regarding the company’s performance made by these independent analysts are theirs alone and do not represent opinions, forecasts, or predictions of Micron or its management. Micron does not by its reference above or distribution imply its endorsement of or concurrence with such information, conclusions, or recommendations.

What were your earnings last fiscal quarter?

On April 2, 2008, Micron Technology, Inc. announced results of operations for its second fiscal quarter of 2008. As a result of the company's current market capitalization being below book value, the company was required under FASB Statement No. 142 "Goodwill and Other Intangible Assets" to record a non-cash charge of $463 million in the second quarter of fiscal 2008 to write off all the carrying amount of goodwill previously recognized in the company's memory segment. The goodwill write-off does not affect the company's day-to-day operations, cash balance or competitive position. Reflecting the goodwill charge, the company reported a net loss for the second quarter of $1.01 per diluted share. On a non-GAAP basis, without the effect of the charge, the company's net loss for the second quarter would have been $0.41 per diluted share or $314 million.

What were your earnings for the last fiscal year?

On October 2, 2007, Micron Technology, Inc., reported a net loss for fiscal year 2007 of $320 million, or $.42 per diluted share, on $5.7 billion in net sales.

When will you report your next fiscal quarter earnings?

Micron is currently targeting a day between June 16, 2008 and July 2, 2008 after the close of the stock market, to release its third quarter results.

How much cash does Micron currently have?

At the end of the second quarter of fiscal 2008, Micron had cash and short-term investments of $1.8 billion.

What are current and future capital spending levels?

Capital spending for fiscal 2007 was approximately $4 billion. The company had capital expenditures of approximately $1.6 billion during the first six months of fiscal 2008 and received approximately $200 million in cash contributions from Intel Corporation, a partner in the IM Flash joint venture. The company estimates capital expenditures aggregating between $2.5 billion and $3 billion for the 2008 fiscal year.

The Company believes that to develop new product and process technologies, support future growth, achieve operating efficiencies and maintain product quality, it must continue to invest in manufacturing technologies, facilities and capital equipment, research and development, and product and process technologies.

What was depreciation and amortization last year? What do you project for the current year?

Depreciation and amortization was approximately $1.7 billion in fiscal 2007. We estimate depreciation and amortization will be approximately $2.2 billion in fiscal 2008.

In what way does Micron differentiate itself from other semiconductor manufacturers?

Micron leverages research and development efforts and manufacturing scale across a diversified semiconductor product portfolio including Core DRAM, Specialty DRAM, NAND Flash, and CMOS Image Sensors. The Company also focuses on efficient and innovative semiconductor manufacturing and product differentiation. Micron’s manufacturing philosophy of optimizing production facilities by minimizing production steps and die sizes helps Micron remain a cost-effective manufacturer of a broad product portfolio.

Micron is focused on businesses that are semiconductor centric and either enable semiconductor technology or promote the consumption of semiconductor products.

How many manufacturing facilities do you have and where are they located?

We currently own or operate the following facilities:

• Headquarters and manufacturing operations, including fabrication, assembly, test and module assembly, in Boise, Idaho
• Wafer fabrication facility in Avezzano, Italy
• Wafer fabrication facility in Nishiwaki-City, Japan
• Wafer fabrication facility in Manassas, Virginia
• Partial ownership in the TECH joint venture wafer fabrication facility in Singapore
• Partial ownership in the IMFT joint venture wafer fabrication facility in Lehi, UT
• Partial ownership in the IM Flash Singapore joint venture wafer fabrication facility under construction in Singapore. The facility is expected to begin tool installs in the first half of 2009.
• Assembly and test and module assembly operations in Singapore
• Module assembly facility in Puerto Rico

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